PROCESS CAPABILITIES
| Shop Tolerance: | Standard | Advanced |
|---|---|---|
| Minimum Outer Line Width | .003” | .0025” |
| Minimum Inner Line Width | .003” | .0025” |
| Minimum Outer Space, Trace/Trace | .003” | .0025” |
| Minimum Inner Space, Trace/Trace | .003” | .0025” |
| Minimum Space, PCB Edge to Conductor | .010” | .005” |
| Layer-to-Layer Registration | +/- .003” | +/-.002” |
| Maximum Finished PCB Thickness | .250” | .400” |
| Minimum Board Thickness Tolerance | +/- 10% | +/- 4% |
| Dimensions-Fab O.D. | .005” | .003” |
| Fabrication Radius | +/-5 deg. | +/-5 deg. |
| Warpage (inch per inch)(flatness of finished board) | .007”/inch | .003”/inch |
| Minimum Component Pitch | .008” | .004” |
| Minimum Dielectric Thickness | .0025” | .0015” |
| Maximum Number of Layers | 28 | 32+ |
| Impedance Control | +/- 10% | +/- 5% |
| Pad to Hole Size: | Standard | Advance |
|---|---|---|
| Tolerance—Plated Hole Size | +/-.003” | +/-.0015” |
| Minimum Plated Hole Size | .006” | .003” |
| Plane Relief Diameter over drilled hole | .018” | .010”” |
| Minimum Outer Non-Plated Hole to Trace Spacing | .009” | .005” |
| Minimum Inner Non-Plated | .008” | .005” |
| Drilling: | Standard | Advanced |
|---|---|---|
| Minimum Drill Size | .008” | .004” |
| Minimum Drill Size (Above .200 is routed) | .312” | .312” |
| Maximum Aspect Ratio | 10:1 | 16:1 |
| Micro Via Drilling: | Standard | Advanced |
|---|---|---|
| Minimum Drill Size | .006” | .004” |
| Maximum Aspect Ratio | 1:1 | 1:1:5 |
| Testing Capabilities: | Standard | Advance |
|---|---|---|
| Minimum Component Pitch | .008”/side | .004”/side |
| Test Parameters | 250 Volts 20 ohm resist 20 meg ohm iso |
1000 Volts 50 ohm resist 50 meg ohm iso |
| Solder Mask Criteria: | Standard | Advance |
|---|---|---|
| Solder mask clearances Line coverage | .003”/side .004” |
.002”/side .002” |
| SMT Minimum Pad Spacing | .010” | .007” |
| Minimum Solder mask Dam | .004” | .002” |
| Surface Finishes Available: | Standard | Advanced |
|---|---|---|
| HASL Thickness | 40~400u” | 40~400u” |
| Immersion Silver Thickness | 6~18u” | 6~18u” |
| Entek Organic Coating (OSP) | Coverage | Coverage |
| Immersion Ni/Au Thickness | 100~200u” Ni 2~4u” Au | 201~300u” Ni 2~4u” Au |
| Lead Free HASL Thickness | 80~300u” | 80~300u” |
| Hard Gold Thickness | 5~60u” | 61~80u” |
| Soft Gold Thickness | 5~100u” | 5~100u” |
| Other Capabilities: | Standard | Advanced |
|---|---|---|
| Via Fill | Non-conductive | Conductive |
| Blind/Buried Vias | 3 sets | 4 and above |
| Micro Vias | Staggered | Stacked |
| Rigid Flex | 4~6 layers | 8~12 layers |
| Flex | 1~2 layers | 4 and above |
| Edge Castellation (plated edges) | Any Edges | Any Edges |
| Aluminum Core | 1~2 layers | 4 and above |
