Capabilities

PROCESS CAPABILITIES

Shop Tolerance: Standard Advanced
Minimum Outer Line Width .003” .0025”
Minimum Inner Line Width .003” .0025”
Minimum Outer Space, Trace/Trace .003” .0025”
Minimum Inner Space, Trace/Trace .003” .0025”
Minimum Space, PCB Edge to Conductor .010” .005”
Layer-to-Layer Registration +/- .003” +/-.002”
Maximum Finished PCB Thickness .250” .400”
Minimum Board Thickness Tolerance +/- 10% +/- 4%
Dimensions-Fab O.D. .005” .003”
Fabrication Radius +/-5 deg. +/-5 deg.
Warpage (inch per inch)(flatness of finished board) .007”/inch .003”/inch
Minimum Component Pitch .008” .004”
Minimum Dielectric Thickness .0025” .0015”
Maximum Number of Layers 28 32+
Impedance Control +/- 10% +/- 5%
Pad to Hole Size: Standard Advance
Tolerance—Plated Hole Size +/-.003” +/-.0015”
Minimum Plated Hole Size .006” .003”
Plane Relief Diameter over drilled hole .018” .010””
Minimum Outer Non-Plated Hole to Trace Spacing .009” .005”
Minimum Inner Non-Plated .008” .005”
Drilling: Standard Advanced
Minimum Drill Size .008” .004”
Minimum Drill Size (Above .200 is routed) .312” .312”
Maximum Aspect Ratio 10:1 16:1
Micro Via Drilling: Standard Advanced
Minimum Drill Size .006” .004”
Maximum Aspect Ratio 1:1 1:1:5
Testing Capabilities: Standard Advance
Minimum Component Pitch .008”/side .004”/side
Test Parameters 250 Volts
20 ohm resist
20 meg ohm iso
1000 Volts
50 ohm resist
50 meg ohm iso
Solder Mask Criteria: Standard Advance
Solder mask clearances Line coverage .003”/side
.004”
.002”/side
.002”
SMT Minimum Pad Spacing .010” .007”
Minimum Solder mask Dam .004” .002”
Surface Finishes Available: Standard Advanced
HASL Thickness 40~400u” 40~400u”
Immersion Silver Thickness 6~18u” 6~18u”
Entek Organic Coating (OSP) Coverage Coverage
Immersion Ni/Au Thickness 100~200u” Ni 2~4u” Au 201~300u” Ni 2~4u” Au
Lead Free HASL Thickness 80~300u” 80~300u”
Hard Gold Thickness 5~60u” 61~80u”
Soft Gold Thickness 5~100u” 5~100u”
Other Capabilities: Standard Advanced
Via Fill Non-conductive Conductive
Blind/Buried Vias 3 sets 4 and above
Micro Vias Staggered Stacked
Rigid Flex 4~6 layers 8~12 layers
Flex 1~2 layers 4 and above
Edge Castellation (plated edges) Any Edges Any Edges
Aluminum Core 1~2 layers 4 and above