PROCESS CAPABILITIES
Shop Tolerance: | Standard | Advanced |
---|---|---|
Minimum Outer Line Width | .003” | .0025” |
Minimum Inner Line Width | .003” | .0025” |
Minimum Outer Space, Trace/Trace | .003” | .0025” |
Minimum Inner Space, Trace/Trace | .003” | .0025” |
Minimum Space, PCB Edge to Conductor | .010” | .005” |
Layer-to-Layer Registration | +/- .003” | +/-.002” |
Maximum Finished PCB Thickness | .250” | .400” |
Minimum Board Thickness Tolerance | +/- 10% | +/- 4% |
Dimensions-Fab O.D. | .005” | .003” |
Fabrication Radius | +/-5 deg. | +/-5 deg. |
Warpage (inch per inch)(flatness of finished board) | .007”/inch | .003”/inch |
Minimum Component Pitch | .008” | .004” |
Minimum Dielectric Thickness | .0025” | .0015” |
Maximum Number of Layers | 28 | 32+ |
Impedance Control | +/- 10% | +/- 5% |
Pad to Hole Size: | Standard | Advance |
---|---|---|
Tolerance—Plated Hole Size | +/-.003” | +/-.0015” |
Minimum Plated Hole Size | .006” | .003” |
Plane Relief Diameter over drilled hole | .018” | .010”” |
Minimum Outer Non-Plated Hole to Trace Spacing | .009” | .005” |
Minimum Inner Non-Plated | .008” | .005” |
Drilling: | Standard | Advanced |
---|---|---|
Minimum Drill Size | .008” | .004” |
Minimum Drill Size (Above .200 is routed) | .312” | .312” |
Maximum Aspect Ratio | 10:1 | 16:1 |
Micro Via Drilling: | Standard | Advanced |
---|---|---|
Minimum Drill Size | .006” | .004” |
Maximum Aspect Ratio | 1:1 | 1:1:5 |
Testing Capabilities: | Standard | Advance |
---|---|---|
Minimum Component Pitch | .008”/side | .004”/side |
Test Parameters | 250 Volts 20 ohm resist 20 meg ohm iso |
1000 Volts 50 ohm resist 50 meg ohm iso |
Solder Mask Criteria: | Standard | Advance |
---|---|---|
Solder mask clearances Line coverage | .003”/side .004” |
.002”/side .002” |
SMT Minimum Pad Spacing | .010” | .007” |
Minimum Solder mask Dam | .004” | .002” |
Surface Finishes Available: | Standard | Advanced |
---|---|---|
HASL Thickness | 40~400u” | 40~400u” |
Immersion Silver Thickness | 6~18u” | 6~18u” |
Entek Organic Coating (OSP) | Coverage | Coverage |
Immersion Ni/Au Thickness | 100~200u” Ni 2~4u” Au | 201~300u” Ni 2~4u” Au |
Lead Free HASL Thickness | 80~300u” | 80~300u” |
Hard Gold Thickness | 5~60u” | 61~80u” |
Soft Gold Thickness | 5~100u” | 5~100u” |
Other Capabilities: | Standard | Advanced |
---|---|---|
Via Fill | Non-conductive | Conductive |
Blind/Buried Vias | 3 sets | 4 and above |
Micro Vias | Staggered | Stacked |
Rigid Flex | 4~6 layers | 8~12 layers |
Flex | 1~2 layers | 4 and above |
Edge Castellation (plated edges) | Any Edges | Any Edges |
Aluminum Core | 1~2 layers | 4 and above |