► Process Capabilities


 

 

  

Shop Tolerance: Standard Advanced
Minimum Outer Line Width .004” .0025”
Minimum Inner Line Width .004” .0025”
Minimum Outer Space, Trace/Trace .004” .0025”
Minimum Inner Space, Trace/Trace .004” .0025”
Minimum Space, PCB Edge to Conductor .010” .005”
Layer-to-Layer Registration +/- .003” +/-.002”
Maximum Finished PCB Thickness .250” .400”
Minimum Board Thickness Tolerance +/- 10% +/- 4%
Dimensions-Fab O.D. .005” .003”
Fabrication Radius +/-5 deg. +/-5 deg.
Warpage (inch per inch)(flatness of finished board) .007” .003”
Minimum Component Pitch .008” .004”
Minimum Dielectric Thickness .0025” .0015”
Maximum Number of Layers 16 22
Impedance Control +/- 10% +/- 5%

Pad to Hole Size: Standard Advanced
Tolerance—Plated Hole Size +/-.003” +/-.0015”

Nominal Finished Hole Size

.008”

.006”

Plane Relief Diameter over drilled hole

.018”

.010”

Minimum Outer Non-Plated Hole to Trace Spacing

.009”

.005”

Minimum Inner Non-Plated

.009”

.008”

Drilling:

Standard

Advanced

Minimum Drill Size

.010”

.008”

Maximum Drill Size (Above .200 is routed)

.257”

.257”

Maximum Aspect Ratio

10:1

12:1

Testing Capabilities:

Standard

Advanced

Minimum Component Pitch

.008”

.004”

Test Parameters

100 Volt 
10 ohm resist
10 meg ohm iso

250 Volt   
50 ohm resist
50 meg ohm iso 


Soldermask Criteria:

Standard

Advanced

Soldermask clearances (no mask on pads/complete line coverage

.004”    (.002/side)

.002”           (.001/side)

SMT Minimum Pad Spacing

.007”

.005”

Minimum Soldermask Dam

.004”

.003”

Surface Finishes Available: Standard Advanced
HASL Minimum Thickness .0003” .0003”
Immersion Silver 8~15 u in. 8~15 u in.
Entek Organic Coating (OSP) Co-Planarity= To Cu. Plate
Immersion Ni/Au Minimum Thickness 2~5 std. u in. 2~5 std. u in.

Via Fill:  Standard  Advanced
Inner Layers Conductive NonConductive
Outer Layers NonConductive Conductive
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